Capacitance study of integrated circuits matrix interconnects
Propagation delays and couplings between nearby lines affect the circuit performances (speed, power consumption) and operations. Propagation delays in longer lines can become critical compared to the clock frequency and can induce unwanted signals in neighboring lines ("crosstalk" phenomen...
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Institute of Advanced Engineering and Science,
2021-05-01.
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LEADER | 02523 am a22003373u 4500 | ||
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001 | 0 nhttps:__ijeecs.iaescore.com_index.php_IJEECS_article_downloadSuppFile_23607_3398 | ||
042 | |a dc | ||
100 | 1 | 0 | |a Lakhlef, Ahcene |e author |
100 | 1 | 0 | |e contributor |
700 | 1 | 0 | |a Benfdila, Arezki |e author |
700 | 1 | 0 | |a Belhimer, Lounas |e author |
245 | 0 | 0 | |a Capacitance study of integrated circuits matrix interconnects |
260 | |b Institute of Advanced Engineering and Science, |c 2021-05-01. | ||
500 | |a https://ijeecs.iaescore.com/index.php/IJEECS/article/view/23607 | ||
520 | |a Propagation delays and couplings between nearby lines affect the circuit performances (speed, power consumption) and operations. Propagation delays in longer lines can become critical compared to the clock frequency and can induce unwanted signals in neighboring lines ("crosstalk" phenomenon). Induced line capacitances can induce parasitic signals. Hence characterizing of these capacitances is of paramount importance. The present work deals with the analysis of capacitance of a multilayer conductor interconnect aiming for their possible exact extraction. We used three topologies of a microstrip conductor interconnects and identified the potential distributor and then computed the capacitance and inductance matrix using a finite element method. The first analysis dealt with parallel microstrip conductors and the second with two levels (plan) of a microstrip conductors the results are compared to those obtained by other methods and found quite encouraging. | ||
540 | |a Copyright (c) 2021 Institute of Advanced Engineering and Science | ||
540 | |a http://creativecommons.org/licenses/by-nc/4.0 | ||
546 | |a eng | ||
690 | |||
690 | |a Interconnects; Multiconductor; Capacitance; Inductance; Integrated Circuits | ||
655 | 7 | |a info:eu-repo/semantics/article |2 local | |
655 | 7 | |a info:eu-repo/semantics/publishedVersion |2 local | |
655 | 7 | |2 local | |
786 | 0 | |n Indonesian Journal of Electrical Engineering and Computer Science; Vol 22, No 2: May 2021; 1156-1164 | |
786 | 0 | |n 2502-4760 | |
786 | 0 | |n 2502-4752 | |
786 | 0 | |n 10.11591/ijeecs.v22.i2 | |
787 | 0 | |n https://ijeecs.iaescore.com/index.php/IJEECS/article/view/23607/15012 | |
787 | 0 | |n https://ijeecs.iaescore.com/index.php/IJEECS/article/downloadSuppFile/23607/3398 | |
856 | 4 | 1 | |u https://ijeecs.iaescore.com/index.php/IJEECS/article/view/23607/15012 |z Get fulltext |
856 | 4 | 1 | |u https://ijeecs.iaescore.com/index.php/IJEECS/article/downloadSuppFile/23607/3398 |z Get fulltext |