High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for th...
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| Format: | Book Chapter |
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KIT Scientific Publishing
2013
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| Online Access: | Get Fullteks DOAB: description of the publication |
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| LEADER | 01540naaaa2200277uu 4500 | ||
|---|---|---|---|
| 001 | doab_20_500_12854_49267 | ||
| 005 | 20210211 | ||
| 020 | |a KSP/1000034759 | ||
| 020 | |a 9783731500254 | ||
| 024 | 7 | |a 10.5445/KSP/1000034759 |c doi | |
| 041 | 0 | |a English | |
| 042 | |a dc | ||
| 100 | 1 | |a Burger, Sofie |4 auth | |
| 245 | 1 | 0 | |a High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method |
| 260 | |b KIT Scientific Publishing |c 2013 | ||
| 300 | |a 1 electronic resource (XII, 140 p. p.) | ||
| 506 | 0 | |a Open Access |2 star |f Unrestricted online access | |
| 520 | |a In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for thin films on Si substrate is presented. The specialty of this method is to test one sample at different strain amplitudes at the same time and measure an entire lifetime curve with only one experiment. | ||
| 540 | |a Creative Commons |f https://creativecommons.org/licenses/by-nc-nd/4.0/ |2 cc |4 https://creativecommons.org/licenses/by-nc-nd/4.0/ | ||
| 546 | |a English | ||
| 653 | |a damage structure | ||
| 653 | |a Fatigue | ||
| 653 | |a thin film | ||
| 653 | |a cantilever bending | ||
| 856 | 4 | 0 | |a www.oapen.org |u https://www.ksp.kit.edu/9783731500254 |7 0 |z Get Fullteks |
| 856 | 4 | 0 | |a www.oapen.org |u https://directory.doabooks.org/handle/20.500.12854/49267 |7 0 |z DOAB: description of the publication |