Influence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates
Ink-jet printed devices on the flexible substrate are inexpensive and large area compatible as compared to rigid substrates. However, during fabrication and service they are subjected to complex strains, resulting in crack formation or delamination within the layers, affecting the device performance...
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Main Author: | |
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Format: | Book Chapter |
Published: |
KIT Scientific Publishing
2019
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Subjects: | |
Online Access: | Get Fullteks DOAB: description of the publication |
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Summary: | Ink-jet printed devices on the flexible substrate are inexpensive and large area compatible as compared to rigid substrates. However, during fabrication and service they are subjected to complex strains, resulting in crack formation or delamination within the layers, affecting the device performance. Therefore, it is necessary to understand their failure mechanisms by correlating their electrical or structural properties with applied strain, supported by detailed microstructural investigations. |
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Physical Description: | 1 electronic resource (X, 127 p. p.) |
ISBN: | KSP/1000086125 9783731508533 |
Access: | Open Access |