Influence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates

Ink-jet printed devices on the flexible substrate are inexpensive and large area compatible as compared to rigid substrates. However, during fabrication and service they are subjected to complex strains, resulting in crack formation or delamination within the layers, affecting the device performance...

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Bibliographic Details
Main Author: Mishra, Nilesha (auth)
Format: Book Chapter
Published: KIT Scientific Publishing 2019
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Online Access:Get Fullteks
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Summary:Ink-jet printed devices on the flexible substrate are inexpensive and large area compatible as compared to rigid substrates. However, during fabrication and service they are subjected to complex strains, resulting in crack formation or delamination within the layers, affecting the device performance. Therefore, it is necessary to understand their failure mechanisms by correlating their electrical or structural properties with applied strain, supported by detailed microstructural investigations.
Physical Description:1 electronic resource (X, 127 p. p.)
ISBN:KSP/1000086125
9783731508533
Access:Open Access