Wide Bandgap Based Devices : Design, Fabrication and Applications

Emerging wide bandgap (WBG) semiconductors hold the potential to advance the global industry in the same way that, more than 50 years ago, the invention of the silicon (Si) chip enabled the modern computer era. SiC- and GaN-based devices are starting to become more commercially available. Smaller, f...

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Bibliographic Details
Other Authors: Medjdoub, Farid (Editor)
Format: Book Chapter
Published: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute 2021
Subjects:
GaN
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Online Access:Get Fullteks
DOAB: description of the publication
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020 |a books978-3-0365-0567-1 
020 |a 9783036505664 
020 |a 9783036505671 
024 7 |a 10.3390/books978-3-0365-0567-1  |c doi 
041 0 |a English 
042 |a dc 
072 7 |a TB  |2 bicssc 
100 1 |a Medjdoub, Farid  |4 edt 
700 1 |a Medjdoub, Farid  |4 oth 
245 1 0 |a Wide Bandgap Based Devices : Design, Fabrication and Applications 
260 |a Basel, Switzerland  |b MDPI - Multidisciplinary Digital Publishing Institute  |c 2021 
300 |a 1 electronic resource (242 p.) 
506 0 |a Open Access  |2 star  |f Unrestricted online access 
520 |a Emerging wide bandgap (WBG) semiconductors hold the potential to advance the global industry in the same way that, more than 50 years ago, the invention of the silicon (Si) chip enabled the modern computer era. SiC- and GaN-based devices are starting to become more commercially available. Smaller, faster, and more efficient than their counterpart Si-based components, these WBG devices also offer greater expected reliability in tougher operating conditions. Furthermore, in this frame, a new class of microelectronic-grade semiconducting materials that have an even larger bandgap than the previously established wide bandgap semiconductors, such as GaN and SiC, have been created, and are thus referred to as "ultra-wide bandgap" materials. These materials, which include AlGaN, AlN, diamond, Ga2O3, and BN, offer theoretically superior properties, including a higher critical breakdown field, higher temperature operation, and potentially higher radiation tolerance. These attributes, in turn, make it possible to use revolutionary new devices for extreme environments, such as high-efficiency power transistors, because of the improved Baliga figure of merit, ultra-high voltage pulsed power switches, high-efficiency UV-LEDs, and electronics. This Special Issue aims to collect high quality research papers, short communications, and review articles that focus on wide bandgap device design, fabrication, and advanced characterization. The Special Issue will also publish selected papers from the 43rd Workshop on Compound Semiconductor Devices and Integrated Circuits, held in France (WOCSDICE 2019), which brings together scientists and engineers working in the area of III-V, and other compound semiconductor devices and integrated circuits. 
540 |a Creative Commons  |f https://creativecommons.org/licenses/by/4.0/  |2 cc  |4 https://creativecommons.org/licenses/by/4.0/ 
546 |a English 
650 7 |a Technology: general issues  |2 bicssc 
653 |a GaN 
653 |a high-electron-mobility transistor (HEMT) 
653 |a ultra-wide band gap 
653 |a GaN-based vertical-cavity surface-emitting laser (VCSEL) 
653 |a composition-graded AlxGa1−xN electron blocking layer (EBL) 
653 |a electron leakage 
653 |a GaN laser diode 
653 |a distributed feedback (DFB) 
653 |a surface gratings 
653 |a sidewall gratings 
653 |a AlGaN/GaN 
653 |a proton irradiation 
653 |a time-dependent dielectric breakdown (TDDB) 
653 |a reliability 
653 |a normally off 
653 |a power cycle test 
653 |a SiC micro-heater chip 
653 |a direct bonded copper (DBC) substrate 
653 |a Ag sinter paste 
653 |a wide band-gap (WBG) 
653 |a thermal resistance 
653 |a amorphous InGaZnO 
653 |a thin-film transistor 
653 |a nitrogen-doping 
653 |a buried-channel 
653 |a stability 
653 |a 4H-SiC 
653 |a turn-off loss 
653 |a ON-state voltage 
653 |a breakdown voltage (BV) 
653 |a IGBT 
653 |a wide-bandgap semiconductor 
653 |a high electron mobility transistors 
653 |a vertical gate structure 
653 |a normally-off operation 
653 |a gallium nitride 
653 |a asymmetric multiple quantum wells 
653 |a barrier thickness 
653 |a InGaN laser diodes 
653 |a optical absorption loss 
653 |a electron leakage current 
653 |a wide band gap semiconductors 
653 |a numerical simulation 
653 |a terahertz Gunn diode 
653 |a grooved-anode diode 
653 |a Gallium nitride (GaN) high-electron-mobility transistors (HEMTs) 
653 |a vertical breakdown voltage 
653 |a buffer trapping effect 
653 |a gallium nitride (GaN) 
653 |a power switching device 
653 |a active power filter (APF) 
653 |a power quality (PQ) 
653 |a metal-insulator-semiconductor high-electron-mobility transistor (MIS-HEMT) 
653 |a recessed gate 
653 |a double barrier 
653 |a high-electron-mobility transistors 
653 |a copper metallization 
653 |a millimeter wave 
653 |a wide bandgap semiconductors 
653 |a flexible devices 
653 |a silver nanoring 
653 |a silver nanowire 
653 |a polyol method 
653 |a cosolvent 
653 |a tungsten trioxide film 
653 |a spin coating 
653 |a optical band gap 
653 |a morphology 
653 |a electrochromism 
653 |a self-align 
653 |a hierarchical nanostructures 
653 |a ZnO nanorod/NiO nanosheet 
653 |a photon extraction efficiency 
653 |a photonic emitter 
653 |a wideband 
653 |a HEMT 
653 |a power amplifier 
653 |a jammer system 
653 |a GaN 5G 
653 |a high electron mobility transistors (HEMT) 
653 |a new radio 
653 |a RF front-end 
653 |a AESA radars 
653 |a transmittance 
653 |a distortions 
653 |a optimization 
653 |a GaN-on-GaN 
653 |a schottky barrier diodes 
653 |a high-energy α-particle detection 
653 |a low voltage 
653 |a thick depletion width detectors 
653 |a n/a 
856 4 0 |a www.oapen.org  |u https://mdpi.com/books/pdfview/book/3759  |7 0  |z Get Fullteks 
856 4 0 |a www.oapen.org  |u https://directory.doabooks.org/handle/20.500.12854/76339  |7 0  |z DOAB: description of the publication