3D Double Gate FinFET Construction of 30 nm Technology Node Impact Towards Short Channel Effect

This paper presents an investigation on properties of Double Gate FinFET (DGFinFET) and impact of physical properties of FinFET towards short channel effects (SCEs) for 30 nm device, where depletion-layer widths of the source-drain corresponds to the channel length aside from constant fin height (HF...

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Main Authors: F. Roslan, Ameer (Author), Salehuddin, F. (Author), M.Zain, A.S (Author), Kaharudin, K.E (Author), Hazura, H. (Author), Hanim, A.R (Author), Idris, S. K (Author), Zarina, B.Z (Author), Maheran A.H, Afifah (Author)
Format: EJournal Article
Published: Institute of Advanced Engineering and Science, 2018-12-01.
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001 ijeecs15268_10130
042 |a dc 
100 1 0 |a F. Roslan, Ameer  |e author 
100 1 0 |e contributor 
700 1 0 |a Salehuddin, F.  |e author 
700 1 0 |a M.Zain, A.S.  |e author 
700 1 0 |a Kaharudin, K.E.  |e author 
700 1 0 |a Hazura, H.  |e author 
700 1 0 |a Hanim, A.R  |e author 
700 1 0 |a Idris, S. K  |e author 
700 1 0 |a Zarina, B.Z.  |e author 
700 1 0 |a Maheran A.H, Afifah  |e author 
245 0 0 |a 3D Double Gate FinFET Construction of 30 nm Technology Node Impact Towards Short Channel Effect 
260 |b Institute of Advanced Engineering and Science,   |c 2018-12-01. 
500 |a https://ijeecs.iaescore.com/index.php/IJEECS/article/view/15268 
520 |a This paper presents an investigation on properties of Double Gate FinFET (DGFinFET) and impact of physical properties of FinFET towards short channel effects (SCEs) for 30 nm device, where depletion-layer widths of the source-drain corresponds to the channel length aside from constant fin height (HFIN) and the fin thickness (TFIN). Virtual fabrication process of 3-dimensional (3D) design is applied throughout the study and its electrical characterization is employed and substantial is shown towards the FinFET design whereby in terms of the ratio of drive current against the leakage current (ION/IOFF ratio) at 563138.35 compared to prediction made by the International Technology Roadmap Semiconductor (ITRS) 2013. Conclusively, the incremental in ratio has fulfilled the desired in incremental on the drive current as well as reductions of the leakage current. Threshold voltage (VTH) meanwhile has also achieved the nominal requirement predicted by the International Technology Roadmap Semiconductor (ITRS) 2013 for which is at 0.676±12.7% V. The ION , IOFF and VTH obtained from the device has proved to meet the minimum requirement by ITRS 2013 for low performance Multi-Gate technology. 
540 |a Copyright (c) 2018 Institute of Advanced Engineering and Science 
540 |a http://creativecommons.org/licenses/by-nc/4.0 
546 |a eng 
690
690 |a MOSFET; Multi Gate; Double-Gate FinFET; Short Channel Effects. 
655 7 |a info:eu-repo/semantics/article  |2 local 
655 7 |a info:eu-repo/semantics/publishedVersion  |2 local 
655 7 |2 local 
786 0 |n Indonesian Journal of Electrical Engineering and Computer Science; Vol 12, No 3: December 2018; 1358-1365 
786 0 |n 2502-4760 
786 0 |n 2502-4752 
786 0 |n 10.11591/ijeecs.v12.i3 
787 0 |n https://ijeecs.iaescore.com/index.php/IJEECS/article/view/15268/10130 
856 4 1 |u https://ijeecs.iaescore.com/index.php/IJEECS/article/view/15268/10130  |z Get fulltext