On the Design of Laser Structured Ka Band Multi-Chip Module
The rapid prototyping of millimeter wave (MMW) multi-chip module (MCM) on low-cost ceramic-polymer composite substrate using laser ablation process is presented. A Ka band MCM front-end receiver is designed, fabricated and tested. The complete front-end receiver module except the IF and power distri...
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| Main Authors: | , , |
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| Format: | EJournal Article |
| Published: |
Institute of Advanced Engineering and Science,
2014-02-01.
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| Subjects: | |
| Online Access: | Get fulltext |
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