Lubrication in Chemical and Mechanical Planarization
Chemical mechanical planarization (CMP) has been widely used in integrated circuit (IC) processing to achieve both local and global surface planarity through combined chemical and mechanical actions. The lubrication plays a significant role in CMP and can be determined by the Stribeck curve since it...
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| Main Authors: | , |
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| Format: | Ebooks |
| Published: |
IntechOpen,
2016-10-26.
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| Online Access: | Get Online |
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Internet
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| Call Number: |
A1234.567 |
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| Copy 1 | Available |