Design of on-chip temperature-based digital signal processing for customized wireless microcontroller
Dramatic rises in power density and die sizes inside system-on-chip (SoC) design have led to the thermal issue. High temperatures or uneven temperature distributions may result not only in reliability issues, also has become the biggest issue that can limit the system performance. This paper presen...
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| Main Authors: | , , , , , |
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| Format: | EJournal Article |
| Published: |
Institute of Advanced Engineering and Science,
2019-05-01.
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| Subjects: | |
| Online Access: | Get fulltext |
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| Call Number: |
A1234.567 |
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| Copy 1 | Available |