Development of photodiode via the rapid melt growth (RMG) materials for energy conversion device

Germanium (Ge) photodiodes were fabricated with the new RMG crucible materials that were established in this study. Results show that Ge large square patterns with size of 208 µm x 208 µm were unable to be achieved if ion implantation process was used in formation of photodiode. Delamination can be...

Full description

Saved in:
Bibliographic Details
Main Authors: Zainal, Nurfarina (Author), Mitchell, S. J.N (Author), McNeill, D. W. (Author), Jubadi, W. M. (Author)
Format: EJournal Article
Published: Institute of Advanced Engineering and Science, 2020-06-01.
Subjects:
Online Access:Get fulltext
Tags: Add Tag
No Tags, Be the first to tag this record!
LEADER 03118 am a22003253u 4500
001 ijeecs21126_13741
042 |a dc 
100 1 0 |a Zainal, Nurfarina  |e author 
100 1 0 |e contributor 
700 1 0 |a Mitchell, S. J.N.  |e author 
700 1 0 |a McNeill, D. W.  |e author 
700 1 0 |a Jubadi, W. M.  |e author 
245 0 0 |a Development of photodiode via the rapid melt growth (RMG) materials for energy conversion device 
260 |b Institute of Advanced Engineering and Science,   |c 2020-06-01. 
500 |a https://ijeecs.iaescore.com/index.php/IJEECS/article/view/21126 
520 |a Germanium (Ge) photodiodes were fabricated with the new RMG crucible materials that were established in this study. Results show that Ge large square patterns with size of 208 µm x 208 µm were unable to be achieved if ion implantation process was used in formation of photodiode. Delamination can be observed on all test samples during polycrystalline silicon (poly-Si) deposition at 620 oC. This result was in contrast to a previous intrinsic Ge test structure, where good formation of squares with size similar to that 208 µm x 208 µm had been successfully attained even with high annealing temperature above 938 oC. This indicates that doping through ion implantation has affected Ge film and caused delamination even at low temperature. However, good formations of Ge stripes were attained along with the ion implantation process in fabricating the photodiode. Results show that the sheet resistance of Ge stripe has significantly decreased compared to previous Ge resistors. The better resistance is due to the thicker (500 nm) Ge layer. In the case of Ge stripes with a p-i-n junction, only small fraction of test samples have shown a diode characteristic but with high leakage current. Results of I-V measurement show that a large fraction of test samples produced resistor characteristics. The high leakage current is believed due to the fact that the Ge films formed at this stage were polycrystalline in structure. Thus the grain size of Ge stripe has affected the performance. Slight changes on the I-V characteristic of single Ge can be observed when samples were tested under illumination. Therefore, it has potential to be used for future development of energy conversion device.  
540 |a Copyright (c) 2019 Institute of Advanced Engineering and Science 
540 |a http://creativecommons.org/licenses/by-nc/4.0 
546 |a eng 
690
690 |a Germanium (Ge), Ge photodiode, Rapid melt growth (RMG), Ge resistor Energy conversion device, Thermophotovoltaic (TPV), Photovoltaic (PV) 
655 7 |a info:eu-repo/semantics/article  |2 local 
655 7 |a info:eu-repo/semantics/publishedVersion  |2 local 
655 7 |2 local 
786 0 |n Indonesian Journal of Electrical Engineering and Computer Science; Vol 18, No 3: June 2020; 1188-1198 
786 0 |n 2502-4760 
786 0 |n 2502-4752 
786 0 |n 10.11591/ijeecs.v18.i3 
787 0 |n https://ijeecs.iaescore.com/index.php/IJEECS/article/view/21126/13741 
856 4 1 |u https://ijeecs.iaescore.com/index.php/IJEECS/article/view/21126/13741  |z Get fulltext